Reliability of Microelectronic Components
Microelectronic Components have penetrated a large variety of application areas. This trend continues by scaling down dimensions of structures and devices, which allows further increase of functionality in smaller volumes of electronic components and systems at favourable cost. However this is accompanied by increasing requirements and expectations concerning their safe function under the intended conditions of application, i.e. their reliability.
This lecture treats the procedures and their physical basis for assuring the reliability of components.
- Reliability basics: characteristics of components reliability, system reliability, life time phases, descriptive statistics and models
- Stability of physical properties dependent on construction (design) and application stresses (mission profile), reliable operating area
- Degrading mechanisms and their activation, basics of accelerated testing, reliability prognostics and modeling
- Characteristic examples of degrading mechanisms, causes and effects of micro defects, accidental external impacts on component reliability
- Test methodology and evaluation, reliability qualification of semiconductor components and manufacturing technologies
- Reliability management in the development phase: methodology of systematic transformation of requirements for components and intended application conditions
- Development trends of microelectronics
The lecture "Reliability of Microelectronic Components" will be held in english!
Wednesday, Room EI N 5325 , 15.00 – 16.30 h
frequency : every 2 weeks, see TumOnline for the detailed time table.
is going to take place on 15.02.2017 at 14.30, Room EI N 5325
There will be a 30-minute written part and a 30-minute oral exam. The oral exams will be on the same day shortly after the written part.
Dr.-Ing. W. Gerling (formerly Siemens Semiconductors / Infineon Technologies: Reliability Engineering, Failure Analysis, Quality Management)
The lecture documents can be found here.